JPS6435528U - - Google Patents

Info

Publication number
JPS6435528U
JPS6435528U JP12795487U JP12795487U JPS6435528U JP S6435528 U JPS6435528 U JP S6435528U JP 12795487 U JP12795487 U JP 12795487U JP 12795487 U JP12795487 U JP 12795487U JP S6435528 U JPS6435528 U JP S6435528U
Authority
JP
Japan
Prior art keywords
heater
temperature
humidity
sensor
dew point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12795487U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12795487U priority Critical patent/JPS6435528U/ja
Publication of JPS6435528U publication Critical patent/JPS6435528U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
JP12795487U 1987-08-22 1987-08-22 Pending JPS6435528U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12795487U JPS6435528U (en]) 1987-08-22 1987-08-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12795487U JPS6435528U (en]) 1987-08-22 1987-08-22

Publications (1)

Publication Number Publication Date
JPS6435528U true JPS6435528U (en]) 1989-03-03

Family

ID=31380850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12795487U Pending JPS6435528U (en]) 1987-08-22 1987-08-22

Country Status (1)

Country Link
JP (1) JPS6435528U (en])

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7215018B2 (en) 2004-04-13 2007-05-08 Vertical Circuits, Inc. Stacked die BGA or LGA component assembly
US7245021B2 (en) 2004-04-13 2007-07-17 Vertical Circuits, Inc. Micropede stacked die component assembly
US7521797B2 (en) 2004-03-18 2009-04-21 Seiko Epson Corporation Method of manufacturing substrate joint body, substrate joint body and electrooptical device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7521797B2 (en) 2004-03-18 2009-04-21 Seiko Epson Corporation Method of manufacturing substrate joint body, substrate joint body and electrooptical device
US7215018B2 (en) 2004-04-13 2007-05-08 Vertical Circuits, Inc. Stacked die BGA or LGA component assembly
US7245021B2 (en) 2004-04-13 2007-07-17 Vertical Circuits, Inc. Micropede stacked die component assembly

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